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Upcoming Deadlines

Regular Paper Submission: November 28, 2016
Regular Paper Authors Notification: January 30, 2017
Regular Paper Camera Ready and Registration: February 13, 2017
CSEDU 2017, the International Conference on Computer Supported Education, aims at becoming a yearly meeting place for presenting and discussing new educational environments, best practices and case studies on innovative technology-based learning strategies, institutional policies on computer supported education including open and distance education, using computers. In particular, the Web is currently a preferred medium for distance learning and the learning practice in this context is usually referred to as e-learning. CSEDU 2017 is expected to give an overview of the state of the art as well as upcoming trends, and to promote discussion about the pedagogical potential of new learning and educational technologies in the academic and corporate world.

Conference Chair

Bruce M. McLarenCarnegie Mellon University, United States

LOCAL CO-CHAIRS

Bertil MarquesISEP, Portugal
Ana BarataISEP, Portugal
Piedade CarvalhoISEP, Portugal

PROGRAM CO-CHAIRS

Paula EscudeiroInstituto Superior de Engenharia do Porto, Portugal
Gennaro CostagliolaUniversità di Salerno, Italy
Susan ZvacekUniversity of Denver, United States
James UhomoibhiUniversity of Ulster, United Kingdom

Keynote Speaker

Nikol RummelBochum University, Germany

Doctoral Consortium

Chair: Carlos Vaz de Carvalho
Submission: February 24, 2017
Submission: February 24, 2017
 

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library 


It is planned to publish a short list of revised and 
extended versions of presented papers with Springer
in a CCIS Series book (final approval pending)

Technically Sponsored by:

IGIP   IEEE Portugal Section   IEEE Portugal Education Chapter  


In Cooperation with:

ACM In-Cooperation
ACM SIGMIS   ACM SIGITE  


SVERD  

ATIEF   IELA   ASEE   ESERA   SPEE   ITD CNR  
Hedda  


Proceedings will be submitted for indexation by:

DBLP   Thomson   INSPEC   EI   SCOPUS  

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