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CSEDU 2016 will be held in conjunction with ICT4AWE 2016, SMARTGREENS 2016, WEBIST 2016, CLOSER 2016, VEHITS 2016 and IoTBD 2016.
Registration to CSEDU allows free access to the ICT4AWE, SMARTGREENS, WEBIST, CLOSER, VEHITS and IoTBD conferences (as a non-speaker).


Upcoming Deadlines

Regular Paper Submission Extension: December 7, 2015
Regular Paper Authors Notification: January 28, 2016
Regular Paper Camera Ready and Registration: February 12, 2016
CSEDU 2016, the International Conference on Computer Supported Education, aims at becoming a yearly meeting place for presenting and discussing new educational environments, best practices and case studies on innovative technology-based learning strategies, institutional policies on computer supported education including open and distance education, using computers. In particular, the Web is currently a preferred medium for distance learning and the learning practice in this context is usually referred to as e-learning. CSEDU 2016 is expected to give an overview of the state of the art as well as upcoming trends, and to promote discussion about the pedagogical potential of new learning and educational technologies in the academic and corporate world.

Conference Chair

Bruce McLaren (honorary)Carnegie Mellon University, United States


Susan ZvacekUniversity of Denver, United States
James UhomoibhiUniversity of Ulster, United Kingdom
Gennaro CostagliolaUniversità di Salerno, Italy

Keynote Lectures

Alison Clark-WilsonUniversity College London, United Kingdom
Francisco ArcegaUniversidad de Zaragoza, Spain
Leon RothkrantzDelft University of Technology, Netherlands

Doctoral Consortium

Chair: Giuliana Dettori
Submission: February 16, 2016
Submission: February 16, 2016

All papers presented at the conference venue
will be available at the SCITEPRESS Digital Library

It is planned to publish a short list of revised and
extended versions of presented papers with Springer
in a CCIS Series book (final approval pending)

In Cooperation with:

ACM In-Cooperation


Technically Sponsored by:


Proceedings will be submitted for indexation by:

Thomson   INSPEC   DBLP   EI   SCOPUS